Analysis based on
Compact Baking System LSC series
Overview
HORIBA's best-selling baking system has been developed for the vigorous needs of today’s high technology industries. Without the need of a carrier gas, it can provide stable vaporization of materials such as 600 SCCM of TEOS and 2SLM of H2O.
All device maintenance can be performed from the same location at the front of the unit.
Features
- High Flow Rate Gasification.
- The LSC-A100 provides stable gasification of materials such as TEOS 600SCCM and H2O 2SLM.
- All device maintenance can be performed from the same location at the front of the unit.
- An optional PocketPC type PDA can be used to monitor the operating conditions of the LSC and to record and analyze operation logs.
Manufactured by HORIBA STEC
Specifications
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Flow rate generated | H2O 2SLM, TEOS 600 SCCM (Max.) |
Operating pressure | Max. 1.33kPa |
Source tank volume | 2.7L |
Heat regulation method | PID control by the heat regulator |
Liquid surface detection method | Floating switch |
Internal mass flow controller | SEC-8400 series |
Air pressure valve | Bellows type |
Materials in liquid connection and gas contact area | SUS316L, PFA |
Operating Temperature | 20 to 35°C |
External input | Air pressure valve open/close, mass flow controller flow rate setting signal (0 to 5 V DC/0 to 100% F.S.), emergency stop signal, auto zero signal (option) |
External output | Temperature alarm, liquid level H.H. alarm, liquid level signal (H, M, L), READY signal, mass flow controller flow rate output signal ((0 to 5 V DC/0 to 100% F.S.), thermoregulated bath internal fan stop alarm, valve voltage monitor (option) |
Power source | AC 100 V, single phase 50/60 Hz, 1.5 kVA |
Other | Auto-recharge system: Can be connected to LU series. |
* The flow rate control range varies with the type of liquid. | |
* SCCM and SLM are symbols indicating gas flow rate (mL/min, L/min at 0°C, 101.3 kPa). |