Thin Film Control/Analysis

Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.Interference occurs when monochromatic light hits the sample surface, resulting in...

Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.Interference occurs when monochromatic light hits the sample surface, resulting in...

This is an emission analysis type end-point monitor intended for end-point detection or plasma condition control in the plasma-based semiconductor thin-film process. The newly-developed Rapture Intensity algorithm allows accurate...

Products: UVISEL VIS: 210-880 nm | UVISEL FUV: 190-880 nm | UVISEL NIR: 245-2100 nm | UVISEL ER: 190-2100 nm | UVISEL VUV: 145-880 nm

Measure thin film thickness and optical constants. For research and process development.