Wafer Back Side Cooling System GR-300 Series
Overview
Can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. Suitable for cooling systems using Helium, and gas control of wafer cover gas using Argon.
Features
- Pressure control with more stability and accuracy
- Mass flow sensor (Option)
- Compatible for various fitting
- RoHS compliance
Application example
control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.
Manufactured by HORIBA STEC