Particle Characterization
Greetings from your friends at HORIBA Instruments!
Our August newsletter welcomes you to attend our seminar in Minnesota on September 16, visit our new Metal Powder web page and download the following new technical support documents: the new Metal Powder Application Note, the new CMP Slurry Application Note and a Technical Note about unique image analysis features found in the PSA300 software.
Particle Characterization Seminar in Minnesota
HORIBA Instruments is hosting a seminar on Tuesday, September 16 at the Holiday Inn in St. Paul, Minnesota. This seminar will feature acknowledged experts in the field of particle size technology who will discuss applications, problem solving and new developments.
Particle Characterization of Metal Powders
Virtually any metal can be made into a powder through processes including atomization, electrolysis, chemical reduction, and size comminution. The metal powder can then be used to fabricate parts from simple to complex shapes. The technique and study of these processes is known as powder metallurgy, a field of study well acquainted with particle characterization. The size distribution and shape of the powder metal particles influences the physical properties of the parts created. Laser diffraction has become the most popular particle size analysis technique for metal powders and image analysis provides both accurate size and shape information.
View the new web page devoted to Metal Powder.
Application Note AN164 on Particle Size and Shape Analysis of Powdered Metals using laser diffraction and static image analysis (You need to be logged in).
Particle Size Analysis of CMP Slurries using Acoustic Spectroscopy
The presence of a small population of large particles in chemical mechanical polishing (CMP) slurries is known to cause defects in the final products. Acoustic spectroscopy can sense the presence of a small sub-population of large particles in a concentrated dispersion of much smaller particles. The detection limit can be as low as a single one micron particle per 100,000 particles of 100 nm size. This is equivalent to a large particle content of 1 wt. % relative to the total solid content of the chemical mechanical polishing (CMP) slurry. Acoustics offers the additional advantage of making measurements without dilution.
Application Note AN165 Characterization of Chemical Mechanical Polishing Slurries by means of Acoustic Spectroscopy (You need to be logged in).
Unique Image Analysis Features
The PSA300 software created by Clemex comes from a group of scientists working in the field of image analysis for many years. The software has now been customized for particle size and shape applications for use with the PSA300. This is a radically different approach than the software designed by particle sizing companies who recently learned to apply image analysis to this application. Because of the difference in development path the PSA300 software contains many powerful software features that are standard image analysis tools, but are unique in the field of particle characterization.
Technical Note TN151 on Unique PSA300 Software Features (You need to be logged in).
Upcoming Customer Training Courses
The HORIBA particle size analysis group has been steadily expanding our offering of customer training courses. The next laser diffraction training courses will be held in Irvine, CA October 21-22 and in Edison, NJ on November 6-7.
Information on "Boot Camp" customer training course registration.
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