Wafer Back Side Cooling System GR-300 Series

Overview

Can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. Suitable for cooling systems using Helium, and gas control of wafer cover gas using Argon.

Features

  • Pressure control with more stability and accuracy
  • Mass flow sensor (Option)
  • Compatible for various fitting
  • RoHS compliance

Application example

control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

Wafer back side cooling system GR-300

 

 


Manufactured by HORIBA STEC

Schematics

Dimensions of GR-300 Series