Direct Liquid Injection System

Overview

As semiconductor devices get faster, the introduction of new materials into the manufacturing processes to achieve increased levels of integration and higher detail in device construction is needed. As a result of this there is now a larger variety and increased volume requirement of liquid sources used in the semiconductor manufacturing process.

HORIBASTEC is the world leader in the area of liquid source delivery offering a full line up liquid source vaporization control systems utilizing different methodologies including baking, direct injection and mixing to guarantee efficient and stable delivery of vapor to the point of use. Our Auto-refill systems complete the lineup offering uninterrupted, safe and reliable delivery of the liquid precursor increasing uptime and reducing operator handling and risk of process contamination.

Features

  • Compact size
  • Can be installed in a variety of positions.
  • Best-selling TEOS vaporization system models.
  • It combines SEF or LF, and digital control is possible.
  • No need for a special bubbling tank or vaporization tank.
  • Lineup of DeviceNetTM model.
  • RoHS Compliance

Manufactured by HORIBA STEC

Specifications

Model

VC-1420

 

Flow rate generated*1 (During TEOS generation)

Max. 5.0 CCM conversion (liquid phase conversion)

 

Liquids supported

 TEOS, P(OCH3)3, C6F6

Temperature rise

 Max. 150°C

Pressure generated*1

 Reduced pressure

External leak integrity

 1.0x10-8Pa·m3/s

Internal Leak Integrity

 1.0x10-6Pa·m3/s

Wetted mateliar

316L Stainless Steel ( polished surface )

Internal heater volume

 AC 100V to 120V 70W(35Wx2)

Temperature sensor used

Thermocouple K type (CA)

Pressure Resistance

 1.0MPa(G)

 Standard Fitting

 Liquid inlet: 1/8 inch VCR type male Gas outlet: 1/4 inch VCR type female

 

*1 Varies depending on the type of liquid.

 

*CCM is a symbol indicating gas flow rate (mL/min at 25°C, 101.3 kPa).

Schematics