Foreign matter removal device on wafers

100% of the 10μm standard glass beads are removed (5 stuck foreign particles remain). Foreign matter attached to the wafer is automatically removed by air (or N₂) blowing and vacuum suction. HORIBA can  handle up to a wafer size of 200 mm.

• Foreign material elemental analysis of defective parts on SiC wafers
  • Identification of foreign elements that cause defects on SiC wafers
• Foreign matter analysis on wafers in a wide range
  • Analyzing foreign objects within a few square centimeters
• Plating film thickness measurement of printed circuit board wiring
  • Wire plating film thickness measurement of tens of μm width
• Reticle/mask foreign object detection
  • High-throughput foreign object detection
• Foreign matter removal device on wafers
  • Automatic foreign matter removal device using blow & vacuum suction