Wafer Back Side Cooling System GR-300 Series

Übersicht

Can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. Suitable for cooling systems using Helium, and gas control of wafer cover gas using Argon. 

Merkmale

  • Pressure control with more stability and accuracy
  • Mass flow sensor (Option)
  • Compatible for various fitting
  • RoHS compliance

Application example

control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

Wafer back side cooling system GR-300

 

 


Hergestellt von HORIBA STEC

Spezifikationen

GR-300 series SPEC

Diagramme

Dimensions of GR-300 Series

We make an estimate with the introduction of the product which the use of the visitor accepted.Please apply from the inquiry.

Inquiry

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