Elementar Analysatoren

Micro 10µm

Minute areas on circuit boards can also be examined and analyzed on the micro-order

Analyze a 1.0 µm area of a circuit board using a 10 µm-diameter beam.

Measurement Conditions
X-ray Tube Voltage	50 kV
X-ray Tube Current	1.0 mA
X-ray Radiation Diameter	100 µm
Sample	Lead-Free Solder Circuit Boards Sn, Bi, Ag and Ge Solder

Considerations

Voids within a sample could be checked using the penetrating X-ray image obtained by irradiating the sample with a 10 µm-diameter X-ray beam.

From the data measured for tin (Sn), copper (Cu) and bromine (Br) images as well as RGB composite images, it was possible to verify that it was the copper that was causing the ion migration. The ends of the copper pads were not covered by solder, leaving the copper exposed. It could be surmised that this along with the effects of residual flux and residual cleaning solution caused the migration.

Test Sample Provided by Dr. Suganuma, Osaka University

Observation of Internal Structure Using Penetrating Images

The 10 µm-diameter beam can be used, for example, to observe penetrating images of voids (air bubbles) in solder and to analyze element distribution, including ion migration, in minute areas.