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Dry Etching

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.

Fluid Controller & Module


Pressure Insensitive Mass Flow Module

mehr DZ-100

Ultra-thin Mass Flow Controller

mehr FS-3000

Thermal Flow Splitter

mehr GR-300 Series

Wafer Back Side Cooling System

mehr SEC-Z500X Series

Multi Range/Multi Gas Digital Mass Flow Controller

mehr SEC-Z700X Series

Pressure Insensitive Mass Flow Controller

mehr VC Series

Direct Liquid Injection System

mehr XF Series

Digital Liquid Mass Flow Meters

Process Monitor & Endpoint Detector

mehr EV 2.0 Series

Endpoint / Chamber Health Monitor based on Optical Emission Spectroscopy and MWL Interferometry

mehr IT-480 series

High-Accuracy Infrared Thermometers [Stationary type]

mehr IT-270

High-Accuracy Infrared Thermometer [Built-in type]

mehr LEM Series

Camera Endpoint Monitor based on Real Time Laser Interferometry

mehr Micropole System

Residual Gas Analyzer

mehr VS70-MC

Miniature Multi Communication UV-NIR Spectrometer

mehr OES-Star

UV-VIS-NIR Spectrometer

mehr PoliSpectra® M116 MultiTrack Spectrometer

Multispectra, Multifiber, Multichannel Imaging spectrometer with 8-16-32 Simultaneous UV-NIR Spectra

mehr VU90 Spectrometer

Most Compact Vacuum UV Back-Illuminated CCD Spectrometer (VUV-FUV)


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