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Tools/Equipment

HORIBA's expertise in analytical instrumentation has provided the foundations for a range of successful industrial monitoring tools for the semiconductor, pharmaceutical and chemical industries.

The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are patterned in the semiconductor. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers.

For the complementary metal oxide semiconductor process (CMOS), FEOL contains all fabrication steps needed to form fully isolated CMOS elements:

  1. Selecting the type of wafer to be used; Chemical-mechanical planarization and cleaning of the wafer.
  2. Shallow trench isolation (STI) (or LOCOS in early processes, with feature size > 0.25 μm)
  3. Well formation
  4. Gate module formation
  5. Source and drain module formation

Cleaning

Cleaning

Deposition

Deposition

Lithography

Lithography

Etch

Etching

CMP

CMP

Material Characterisation

Packaging

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