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Back-end semiconductor manufacturing refers to the fabrication processes after all of the features/circuits have been created on the wafer. Back-end processing includes dicing of wafer, mounting of chips, wire bonding, molding, etc. so called assembly, and final testing.

HORIBA supports especially in the area of quality control with specialized measuring techniques. For example by conducting failure detection for metal thickness of electric connection to confirm the uniformity of metal thickness on electric parts.

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Pressure Insensitive Mass Flow Module

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Optical Emission Spectroscopy Etching End-point Monitor

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Compact Process Gas Monitor

mehr SEC-N100 Series

Digital Mass Flow Controller

mehr SEC-E Series

Mass Flow Controller

mehr SEC-Z500X Series

Multi Range/Multi Gas Digital Mass Flow Controller

mehr SEC-Z700S Series

New concept Pressure Insensitive Mass Flow Controller

mehr VG Series

Capacitance Manometer

mehr XGT-9000

X-ray Analytical Microscope (Micro-XRF)


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