A measurement cycle of approx. 2 seconds supports concentration management for 300 mm processes.
A very short measurement cycle* of approximately two seconds means fast response. Frequent feedback for both single-bath and batch type cleaning devices is supported.
*Does not include chemical replacement and cooling times.
The compact design of the CS-131, only two-thirds* of previous models allow for easy integration into your wafer cleaning system.
*Compared to the CS-220 series.
Fewer lot defects in the cleaning process means a higher yield
Outputs from the monitor are used for replenishment control of the SC-1 solutions, enabling cleaning with a high reproducibility rate. There are fewer defects in the cleaning process, this helps boost the overall yield.
Fully automated measurement for simplifies control.
Measurement is fully automatic; no control is required once the system has been installed and measurement has begun. Air is used for reference spectral measurement removing the need of a utility water supply.
Comprehensive counter measures to eliminate air bubbles enable the CS-131 to measure of high-temperature samples.
Air bubbles are separated out in a bubble removing tank, while an electromagnetic valve minimizes mixing of air bubbles in the flow cell during measurement. If the monitor has an integrated cooling unit, high-temperature samples can be measured directly. Temperature compensation is carried out automatically.
Low-voltage 24 V DC is used for the power supply, offering improved safety and protection from electrical shock. An internal leakage sensor can be installed to detect leaks; the supply of the SC-1 solutions can then be shut off in the event of an emergency.