- Short 3-second measurement cycle supports concentration control for 300-mm processes
A short measurement cycle of approximately three seconds makes it possible to track concentrations at much closer to real time. Supports fine-tuned concentration control for batch-type-bath as well as single-bath cleaning devices.
- Compact design helps reduce cleaning-device footprint
The compact design reduces the monitor's footprint by about a third*, reducing the amount of space required by the cleaning device. The monitor is easily integrated with the cleaning device.
*Based on comparison with the HORIBA CS-327 series.
- Reduces lot defects in the cleaning process for improved yield
Output from the monitor is used for automated spiking control of the FPM solutions, enabling cleaning with a high reproducibility rate. As a result, lot defects decrease in the cleaning process, which helps to boost the overall yield.
- Fully automated measurement simplifies control
All the user has to do is set up the FPM solution supply. Measurement is fully automatic, so no control whatsoever is required once the measurement has begun. Also, air is used for reference spectral measurement, and water concentrations can also be measured, which allows continuous tracking of changes in water concentration due to evaporation of the solution and adherence to the wafer. This allows fine-tuned control of silicon-oxide etching.
- Comprehensive measures to eliminate air bubbles enable continuous measurement
A built-in bubble removal function removes air bubbles immediately before the flow cell, which allows continuous measurement of the solution as it is flowing.
- 24 V DC used for improved safety
The monitor uses a low-voltage (24 V DC), and running on about 45 W gives it even better electric-shock safety and energy efficiency. An internal leakage sensor is also installed to detect solution leaks, so that the supply of FPM solutions can be shut off in the event of an emergency.