Wafer Back Side Cooling System GR-300 Series

Wafer Back Side Cooling System GR-300 Series

The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.

 

Segment: Semiconductor
Division: Fluid Control
Base product
Manufacturing Company: HORIBA STEC Co. Ltd.
  • Pressure control with more stability and accuracy
  • Mass flow sensor (Option)
  • Compatible for various fitting
  • RoHS compliance

 

Application example

In the below example, the GR-300 Series is controling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

External Dimension

GR-300 - Schematics

 

Pressure Control and Exhaust Pressure Control for Deposition and Etching in Semiconductor Manufacturing Process
Pressure Control and Exhaust Pressure Control for Deposition and Etching in Semiconductor Manufacturing Process
Wafer Back Side Cooling System GR-300 Series Specificaton
CategoryDocuments
Size 0.25 MB
FiletypePDF

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