Wafer Back Side Cooling System GR-300 Series

Wafer Back Side Cooling System GR-300 Series

The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.

 

Segment: Semiconductor
Division: Fluid Control
Base product
Manufacturing Company: HORIBA STEC Co. Ltd.
  • Pressure control with more stability and accuracy
  • Mass flow sensor (Option)
  • Compatible for various fitting
  • RoHS compliance

 

Application example

In the below example, the GR-300 Series is controling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

External Dimension

GR-300 - Schematics

 

Wafer Back Side Cooling System GR-300 Series Specificaton
CategoryDocuments
Size 0.25 MB
FiletypePDF

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