Foreign material elemental analysis of defective parts on SiC wafers

Fast analysis of microscopic metal particles is an important application for engineering (e.g. engine wear analysis). Micro-XRF scanning and spot analysis of specific fragments identifies their chemical composition.

Simultaneous imaging of transmission X-rays and fluorescent X-rays is effective to find defects inside electronic components.

We carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a HORIBA X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.

Our XGT-9000SL allows failure analysis at a microscopic level on a large sample, non-destructively, thanks to its large chamber capacity and its microprobes.

The combination of microbeam and thickness measurement capability makes the XGT-9000 a useful tool for the QC of semiconductors, which feature thin and narrow patterns. Thickness sensitivity depends on elements traced, but can be at the Angstrom level.

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.

Troubleshooting and defect analyses of components embedded within opaque resins are described, on both individual components and complete circuit boards. Quantitative analysis to the ppm level is ideally suited for ensuring compliance to the WEEE/RoHS directives.

The combination of the XGT-5000’s ground breaking spatial resolution and sensitivity means it is the instrument of choice for fast analysis of electronic components, whether for analysis of restricted harmful elements (the WEEE/RoHS ‘lead free’ legislation), trouble shooting, or R&D.