Semiconductors

Silicon Material

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Silicon material continues to be mainstream of next-generation packages that integrate miniaturized chips and chiplets, making it possible to create more complex integrated systems as well as less expensive. HORIBA will contribute with its measurement technology for film thickness measurement, stress analysis, elemental analysis, and foreign material analysis of silicon materials.
 


Film Thickness and Quality  |  Stress Analysis  |  Elemental Analysis  |  Foreign Object Detection/Analysis

Film Thickness and Quality

In the advancement of thin film technology through miniaturization, we propose solutions for achieving high film deposition control, such as in-situ evaluation during the film deposition process and evaluation of thin films at the Ångström order level.


Membrane information obtained using a spectroscopic ellipsometer

Stress Analysis

We propose a multifaceted stress evaluation solution using a Raman spectrometer boasting high wavenumber and spatial resolution, along with cathodoluminescence (CL).

Elemental Analysis

Foreign Object Detection/Analysis

Defects in wafers can also be caused by foreign matter, and we will introduce a method of microscopic elemental analysis to identify the cause of defects.

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