Semiconductor Page Heading

Dry Etch

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.

Related Products

CRITERION D500
more CRITERION D500

Pressure Insensitive Mass Flow Module

DZ-100
more DZ-100

Ultra-thin Mass Flow Controller

EV-140C
more EV-140C

Optical Emission Spectroscopy Etching End-point Monitor

EV 2.0 Series
more EV 2.0 Series

Endpoint / Chamber Health Monitor based on Optical Emission Spectroscopy and MWL Interferometry

FS-3000
more FS-3000

Thermal Flow Splitter

GR-300 Series
more GR-300 Series

Wafer Back Side Cooling System

IT-480 series
more IT-480 series

High-Accuracy Infrared Thermometers [Stationary type]

LEM Series
more LEM Series

Camera Endpoint Monitor based on Real Time Laser Interferometry

MICROPOLE System
more MICROPOLE System

Compact Process Gas Monitor

SEC-Z700S Series
more SEC-Z700S Series

New concept Pressure Insensitive Mass Flow Controller

SEC-Z500X
more SEC-Z500X

Multi Range/Multi Gas Digital Mass Flow Controller

SEC-Z700X Series
more SEC-Z700X Series

Pressure Insensitive Mass Flow Controller

VC Series
more VC Series

Direct Liquid Injection System

VG Series
more VG Series

Capacitance Manometer

XF-100 Series
more XF-100 Series

Digital Liquid Mass Flow Meters

REQUEST FOR INFORMATION

Do you have any questions or requests? Use this form to contact our specialists.