Back-end semiconductor manufacturing refers to the fabrication processes after all of the features/circuits have been created on the wafer. Back-end processing includes dicing of wafer, mounting of chips, wire bonding, molding, etc. so called assembly, and final testing.
HORIBA supports especially in the area of quality control with specialized measuring techniques. For example by conducting failure detection for metal thickness of electric connection to confirm the uniformity of metal thickness on electric parts.
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