Senior Mechanical Design Engineer

The HORIBA Group of worldwide companies provides an extensive array of instruments and systems for applications ranging from automotive R&D, process and environmental monitoring, in-vitro medical diagnostics, semiconductor manufacturing, and metrology, to a broad range of scientific R&D and QC measurements. Proven quality and trustworthy performance have established widespread confidence in the HORIBA Brand.

Inspired by our unique motto, “JOY and FUN,” we focus on social responsibilities by building state-of-the-art products for scientific advancement; especially for protecting health, safety, and the environment. “HORIBARIANs,” the HORIBA employees all over the world, look forward to working with additional creative and entrepreneurial self-starters.

And for years, HORIBA Scientific’s OEM division has been the preferred, reliable, and consistent supplier of OEM spectroscopy components throughout the world … offering a complete range of OEM imaging miniature spectrographs and spectrometers along with CCD, Photodiode array (CMOS), and InGaAs detectors that operate from the UV through to the NIR. Our high-reliability products and know-how are leveraged in a wide range of high-tech industries such as: Medical, Semiconductor, Pharmaceutical, and Biotech to name a few.

Presently, our HORIBA Scientific OEM Division is searching for an experienced Senior Mechanical Design Engineer for our North American operation located in Piscataway, New Jersey.  The ideal candidate will possess a strong mechanical / instrument packaging background and provide individual technical contributions to an engineering team focusing on the design and development of Light Detecting Systems involving CCDs, PDAs, InGaAs, and CMOS sensors for spectroscopy and imaging applications.  If you are a self-motivated individual with a passion for your work that has garnered success in leading and contributing to team-oriented product development efforts, please keep reading and visit our corporate website www.horiba.com to learn more.

Qualifications: 

  • BS degree (or above), in Mechanical Engineering, or relevant equivalent experience.
  • 7-10 years of instrument design experience within the biomedical, scientific or industrial sectors.

 

Responsibilities: 

  • Project contributor to the development and test of Light Detecting Systems involving CCDs, PDAs, InGaAs, and CMOS sensors.
  • Involvement in all mechanical product development aspects including definition, design, qualification, and production support.
  • Electro-mechanical instrument packaging that uses photosensitive detectors, electronic PCBs, Peltiers, optics, and flex circuits.
  • Ability to perform or oversee structural and thermal Finite Element Analysis (FEA) when required.
  • Evaluate/recommend new technologies and design approaches that meet or exceed product performance/cost targets.
  • Participation in project scheduling and cost estimating.
  • Support new and existing product manufacturing infrastructure including fixture designs as required.
  • Strong problem solving, communication, and interpersonal skills.

 

Requirements: 

  • Proficiency in PTC CREO and CAD 3D Design/Modeling techniques.
  • Seasoned product development approach balancing functionality, sustainability, reliability, manufacturability, and aesthetics.
  • Strong knowledge and experience in electro-mechanical cooling techniques including convection and conduction cooling.
  • Tolerance analysis of med/high volume designs with densely populated / highly constrained internal electro-mechanical parts with proficiency in geometric dimensioning and tolerancing.
  • Prior instrument designs involving mixed material fabricated part structures for cost savings (i.e. machined and/or die-cast, plastic-molded, formed sheet metals, and/or readily available off-the-shelf).

 

Preferred Attributes (one or more viewed as a plus): 

  • Previous experience associated with designing cooled CCD/CMOS camera products
  • Working knowledge of vacuum and/or cryogenic processes.
  • Exposure to basic structural and thermal Finite Element Analysis (FEA).
  • Knowledge of thermal electric devices and low outgassing thermal management adhesives/epoxies.
  • Familiarity with instrument power distribution, cooling, and grounding techniques.
  • Utilization of ESD/EMI shielding and gasketing materials for CE product compliance.
  • Experience working on high volume, cost-sensitive products.
  • Previous experience mentoring mechanical staff members

 

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