Release of the “Xtrology” Fully Automated Thin Film Inspection System

|   Press Release

Combines multiple sensors and automation technology to provide increased value for semiconductor wafer inspection.

HORIBA STEC, Co., Ltd. (hereinafter “HORIBA STEC”) is proud to release the Fully Automated Thin Film Inspection System, “Xtrology” on October 15th. 
In recent years, the number of inspection items in the manufacturing process has increased due to technological advances in the semiconductor industry, and the level of inspection requirements continues to rise. The new product, "Xtrology," is a highly customizable system that allows you to select one or multiple sensors from three analysis methods: spectroscopic ellipsometry*1, Raman spectroscopy*2, and photoluminescence*3. This has made it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.

It not only has an automation function that combines our in-house developed automatic conveyance system and non-destructive, non-contact sensors, but also connects multiple external devices, such as open cassettes, SMIF (Standard Mechanical Interface), and FOUP (Front Opening Unified Pod). Continuous measurements can be performed, contributing to more efficient inspection processes and higher yields.

Additionally, because HORIBA has developed all of the sensors, automation technology, and software installed in this device in-house, we are able to provide consistent services and maintenance. Having 29 countries and regions around the world in operations, HORIBA provides long-term global support. We will continue to work on further functional enhancements, such as adding more sensors that can be installed, and will respond to the diverse needs of semiconductor thin film inspection with flexible customization. 
 

Metrology Product Line Manager Kosuke Matsumoto explains, “We developed the Xtrology as a product that conducts the inspection and defect reviews on a wide range of wafer sizes and materials used in legacy and cutting-edge processes for silicon and compound semiconductor-based devices. We offer a variety of solutions by integrating a variety of sensors and automation technologies developed independently based on HORIBA's core technology into one platform.”



*1 An analysis method that determines the thickness and properties of a sample by measuring changes in the vibrations of light incident on the sample and reflected light.
*2 An analysis method that evaluates molecular structure and properties by irradiating a sample with light and detecting the scattered light.
*3 An analytical method that obtains information on defects and impurities by absorbing light at a specific wavelength and measuring the light (fluorescence) emitted by the sample.
 

Fully Automated Thin Film Inspection System, “Xtrology”