Surface Analysis and Thin Film Characterization

Surface analysis and thin film characterization allow the study of a material’s outermost layers, from the nanometer to micrometer scale, to assess composition, thickness, uniformity, and structural integrity. This type of analysis provides critical insights into a material’s surface chemistry, coatings, and layered structures, which influence performance, durability, and functionality.

Different techniques, such as Ellipsometry or Raman and Photoluminescence (PL) Spectroscopy, can provide non-destructive measurement of film thickness and optical properties, and elemental analysis for quality control and regulatory compliance. This analysis is indispensable in fields such as semiconductors, photovoltaics, coatings, metallurgy, and advanced manufacturing, where surface and thin film properties define material behavior, efficiency, and longevity.

What are the key applications of surface and thin film analysis?

By enabling precise control and optimization of material properties, surface and thin film analysis ensures quality assurance, innovation, and research across many industries such as:

  • Semiconductors & Microelectronics – Ensures precise layer thickness, composition, and uniformity, for example in semiconductor fabrication, or the measure of the irregularities of the surface that could impact the devices' performance.
     
  • Photovoltaics & Energy Storage – Characterizes transparent conductive films, absorber layers for solar panels, or electrode coatings in batteries and the surface roughness, porosity, and chemical composition for efficiency improvement of fuel cell membranes.
     
  • Metallurgy & Corrosion Studies – Analyzes oxide layers and corrosion-resistant coatings for durability assessment and investigating elemental distribution in layered metal structures.
     
  • Advanced Materials & Nanotechnology – Measures properties of micro- and nano-scale devices for sensors and actuators, and analyzes structural and electronic properties of nanomaterials, for research and industrial applications of graphene and 2D materials.
     
  • Displays & Optoelectronics – Measures thickness and composition of organic and inorganic layers for improved efficiency in OLED and LED thin films, touchscreen or other transparent conductive layers.
     
  • Packaging – Analyzes thin barrier layers and surface coatings to help evaluate oxygen and moisture barrier efficiency, adhesion of functional coatings, and the uniformity of multilayer films used in food, pharmaceutical, and high-tech packaging.
     

What are the material properties studied with surface and thin film analysis?

Surface and thin film analysis focuses on the outermost layers of materials, where critical interactions and functional behaviors occur. The analyzed properties include:

Structural & Morphological Properties

Focuses on the physical shape, geometry, and internal structure of the thin film.

  • Topography: Surface features, roughness, and 3D profile at micro/nano scale.
     
  • Film Thickness: Key for controlling optical, electrical, and mechanical performance.
     
  • Stress / Strain: Internal mechanical forces that may cause warping, delamination, or failure.
     
  • Crystallinity: Degree of structural order; affects optical and electronic properties.
     
  • Mechanical properties: Hardness, elasticity, adhesion, and wear resistance.
     
  • Defects, Contaminants & Quality Control: Detection and identification of particulates on or within films, and structural anomalies which can impact film quality, uniformity, and yield in production.

Optical and Electronic Properties

Covers how the material interacts with light and electricity, critical for functional and optoelectronic materials.

  • Refractive Index: Determines reflection, refraction, and light propagation in films.
     
  • Band Gap: Essential for semiconductors and optoelectronic behavior (e.g., solar cells, LEDs).
     
  • Carrier Concentration: Number of charge carriers, crucial for conductivity and electronic transport.
     
  • Electrical Properties: Conductivity, resistivity, dielectric behavior, etc.
     
  • Magnetic Properties: Magnetization, coercivity, etc., for spintronics and memory devices.

Chemical and Compositional Properties

Describe the elemental and molecular makeup which governs stability, performance, and compatibility.

  • Chemical Composition: Elemental makeup of the film or surface.
     
  • Stoichiometry: Exact elemental ratios, critical for functional materials like perovskites or oxides.

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What are HORIBA solutions for surface and thin film analysis?

HORIBA solutions contribute uniquely to surface and thin film analysis, and combines them with supporting research and industrial applications to gain a comprehensive understanding of material properties.

Raman and Photoluminescence Spectrometers

Raman Spectroscopy is a powerful tool for surface and thin film analysis, offering non-destructive characterization of molecular composition, crystallinity, and strain effects. By detecting vibrational modes of molecules and lattice structures, Raman provides insights into thin film uniformity, phase purity, and stress distribution, which are crucial for optimizing material performance.

Photoluminescence (PL) spectroscopy, both steady-state and time-resolved, is a key method for investigating optical and electronic properties of thin films. It measures carrier lifetimes, defect states, and energy band structures, helping to assess material quality and efficiency. This technique is extensively used in optoelectronics, LED development, and perovskite solar cells, where optimizing light-emitting and energy conversion properties is fundamental to improving performance and reliability.

Spectroscopic Ellipsometers

Spectroscopic ellipsometry is a highly sensitive technique for measuring the thickness, refractive index, and optical constants of thin films with nanometer precision. Because it is non-contact and non-destructive, it is widely used for monitoring deposition processes, analyzing multi-layered coatings, and assessing the optical behavior of materials. This technique plays a key role in semiconductor manufacturing, display technology, and coatings for optics, ensuring precise control over film properties to enhance product performance and efficiency.

AFM-Raman Solutions

AFM-Raman spectroscopy combines Atomic Force Microscopy (AFM) with Raman Spectroscopy to enable simultaneous nanoscale surface imaging and chemical characterization. AFM measures surface topography, roughness, and mechanical properties such as adhesion, elasticity, and hardness, while Raman spectroscopy provides complementary molecular and structural data. This dual capability is especially useful in thin film coatings, semiconductor processing, and biomaterials, where understanding both the physical and chemical properties at the nanoscale is critical for quality control and research in functional materials.

RF Glow Discharge Spectrometers

Unlike surface-only techniques, Glow Discharge Optical Emission Spectroscopy (GDOES) allows researchers to analyze buried interfaces, diffusion profiles, and multi-layer coatings, making it essential for understanding material composition beyond the surface. This technique is widely used in semiconductors, metallurgy, corrosion studies, and advanced coatings, where controlling layer thickness, composition, and contamination is critical for performance and durability.

Other techniques

  • XRF Spectroscopy – Non-destructive elemental analysis for impurities detection and coating thickness measurement, essential for quality control and compliance in semiconductors, photovoltaics, and metallurgy.
     
  • Cathodoluminescence (CL) Spectroscopy – Reveals optical defects, impurities in thin films, and is widely used in industries such as solar cell development.
     
  • Fluorescence Spectroscopy – Analyzes surface coatings and band gaps, making it valuable for displays, and photovoltaics.
     
  • Particle Analysis – Detects and identifies particles on surfaces, critical for contamination control in cleanroom environments like semiconductor fabrication.
     
  • Elemental Analysis – Measures elements such as C, O, N, H, and S with high sensitivity, important for purity control in metals, ceramics, and electronic materials.
LabRAM Odyssey Semiconductor
LabRAM Odyssey Semiconductor

Photoluminescence and Raman Wafer Imaging

UVISEL Plus
UVISEL Plus

Spectroscopic Ellipsometer from FUV to NIR: 190 to 2100 nm

SignatureSPM
SignatureSPM

Scanning Probe Microscope with Chemical Signature

GD-Profiler 2™
GD-Profiler 2™

Glow Discharge Optical Emission Spectrometer

XGT-9000
XGT-9000

X선 분석 현미경(Micro-XRF)

Cathodoluminescence - CLUE Series
Cathodoluminescence - CLUE Series

Cathodoluminescence Solutions for Electron Microscopy

Fluorolog-QM
Fluorolog-QM

Modular Research Fluorometer for Lifetime and Steady State Measurements

Partica LA-960V2
Partica LA-960V2

레이저 산란 입자 크기 분포 분석기

EMIA-Expert
EMIA-Expert

탄소/황 분석기

EMGA-Expert
EMGA-Expert

산소/질소/수소 분석기

Resources

Webinars

Seeing Through Layers: Analyzing Multi-layer Packaging with Raman Spectroscopy

Join us to explore how Raman spectroscopy can help you uncover the hidden layers of your packaging, ensuring quality control, material consistency, and optimal product protection.

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