Для полупроводников применяются следующие аналитические и инструментальные методы. Нажмите на квадратики для получения дальнейшей информации..

Alloy Composition, Bandgap

Bandgap, PLE / PL

Compound Alloys


Crystallinity (Silicon)

Doping Effects

Ferroelectric Thin Films

Fluorescence Spectra of CdSe Nanoparticles


High, Low k Materials

Analysis of Multilayer Structures on Silicon

ONO Film

Optical Properties

Oxidized Porous Silicon


Plasma Etch End Point

Process Chemicals e.g. Pure Water, H2SO4, H3PO4, HCl, HNO3, NH3, Photo-resist

Porous Silicon

Quality Control Materials for Wafer Manufacturing

Quantitative Analysis of BPSG on Silicon

Raw Materials for Trace Elements

SOI Film

Stress / Strain

Super Lattice Structure and Defect Investigations


Thickness (Monolayer, Multi-Layers, Native Oxide, Roughness, Interface)

Thin Film Transistors, MOSFET, OTFT

Uniformity over Film Area and Depth

Fast elemental depth profiling

Contacts (silicides)