Thin Film Control/Analysis

Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.

Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.Interference occurs when monochromatic light hits the sample surface, resulting in...

Emission analysis type end-point monitor intended for end-point detection or plasma condition control in the plasma-based semiconductor thin-film process.

Products: UVISEL Plus: 190-920 nm | NIR Option: 2100 nm

Measure thin film thickness and optical constants. The reference ellipsometer for research and process development.