Analysis of a Lead Free Solder Circuit Board

Minute areas on circuit boards can also be examined and analyzed on the micro-order

Analyze a 1.0 µm area of a circuit board using a 10 µm-diameter beam.

Measurement Conditions  
X-ray Tube Voltage 50 kV
X-ray Tube Current 1.0 mA
X-ray Radiation Diameter 100 µm
Sample Lead-Free Solder
Circuit Boards
Sn, Bi, Ag and Ge Solder

Considerations

Voids within a sample could be checked using the penetrating X-ray image obtained by irradiating the sample with a 10 µm-diameter X-ray beam.

From the data measured for tin (Sn), copper (Cu) and bromine (Br) images as well as RGB composite images, it was possible to verify that it was the copper that was causing the ion migration. The ends of the copper pads were not covered by solder, leaving the copper exposed. It could be surmised that this along with the effects of residual flux and residual cleaning solution caused the migration.

Test Sample Provided by Dr. Suganuma, Osaka University

Observation of Internal Structure Using Penetrating Images

The 10 µm-diameter beam can be used, for example, to observe penetrating images of voids (air bubbles) in solder and to analyze element distribution, including ion migration, in minute areas.

Observation of Internal Structure Using Penetrating Images

Ion Migration Analysis Using Fluorescence X-rays


Ion Migration Analysis _Sn-K?
Sn-K?
Ion Migration Analysis _Cu-K?
Cu-K?
Ion Migration Analysis _Br-K?
Br-K?
Ion Migration Analysis RGB-synthetic image
RGB-synthetic image(R:Sn G:Cu)
Ion Migration Analysis Image