Direct Liquid Injection System

Overview

As semiconductor devices get faster, the introduction of new materials into the manufacturing processes to achieve increased levels of integration and higher detail in device construction is needed. As a result of this there is now a larger variety and increased volume requirement of liquid sources used in the semiconductor manufacturing process.

HORIBASTEC is the world leader in the area of liquid source delivery offering a full line up liquid source vaporization control systems utilizing different methodologies including baking, direct injection and mixing to guarantee efficient and stable delivery of vapor to the point of use. Our Auto-refill systems complete the lineup offering uninterrupted, safe and reliable delivery of the liquid precursor increasing uptime and reducing operator handling and risk of process contamination.

Features

  • Compact: 1/5 the size of previous models.
  • Can be installed easily in a variety of positions.
  • Best-selling TEOS vaporization system model.
  • No need for a special bubbling tank or vaporization tank.

Manufactured by HORIBA STEC

Specifications

Model

VC-1310

VC-1410

 

Flow rate generated*1 (During TEOS generation)

1.0 CCM or less (liquid phase conversion)

Max. 5.0 CCM conversion (liquid phase conversion)

 

Liquids supported

All liquids except those corrosive to stainless steel (ex, HCl and HF)

 

Temperature rise

Max. 150°C

 

Pressure generated*1

Reduced pressure

 

Leak Integrity

External leak: 1.0 x 10-8 Pa·m3/s (He) or less; Internal leak: 1 x 10-6 Pa·m3/s (He) or less

 

Materials in gas contact area

SUS316L (PTFE)

 

Internal heater volume

AC 100 V, 70 W (35 W x 2)

 

Temperature sensor used

Thermocouple K type (CA)

 

Pressure Resistance

1.0 MPa (G)

 

Standard Fitting

Liquid inlet: 1/16" special joint, 1/8" VCR type male, 1/8" Swagelok type; Gas outlet: 1/4" VCR type male, 1/4" VCR type female

 

 

 

 

 

*1 Varies depending on the type of liquid.

 

 

*CCM is a symbol indicating gas flow rate (mL/min at 25°C, 101.3 kPa).