Reticle/Mask Particle Remover RP-1

Reticle/Mask Particle Remover

The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.

Segment: Semiconductor

Division: Metrology

Manufacturing Company: HORIBA, Ltd.

POINT 1: Dual-Action Blowing and Vacuum Suction Prevents Particle Re-attachment

By removing particles with an air blow while applying vacuum suction at the same time, the system effectively prevents particles from re-attaching to the pellicle surface.

POINT 2: Removes Particles from Both Sides at Once— 1-Minute Processing Time

Because particles on both the top and bottom surfaces can be removed in a single operation, processing time is significantly reduced. With a high throughput of approximately one minute per piece, overall work efficiency is dramatically improved.

POINT 3: Automation Balances Reduced Engineer Workload with Protection for Masks and Pellicles

Automation reduces the burden on engineers while also protecting masks and pellicles. It lowers the risk of contact and damage associated with manual work (e.g., manual blowing). By minimizing human handling, the system suppresses electrostatic charging and helps reduce the risk of electrostatic discharge (ESD) damage.

POINT 4: Seamless Continuous Processing by Linking with a Particle Detection System

When combined with the particle detection system PD10, particle removal and reticle inspection can be performed seamlessly as a continuous process, enabling efficient quality control.
We also offer the integrated particle detection system PD10-EX, which completes both particle detection and removal within a single unit.

Reticle / Mask Particle Detection System PD10

Reticle / Mask Particle Detection System PD10-EX

Notes

* Adhered particles may become more difficult to remove over time. Regular particle removal as part of the mask manufacturing process is recommended.

Overall Dimensions	1320（W）× 1200（D）× 1600（H）mm
Removal Performance (Reference Values) * Based on HORIBA standard glass beads.	Glass surface: 5 µm (90% removal rate) Pellicle surface: 20 µm (90% removal rate)
Supported Mask/Reticle Sizes	5 / 6 / 7 / 9-inch pellicle-mounted masks (*Specify one size.)
Removal Time (Typical)	Approx. 1 minute
Supported Pods/Cases	Nikon / Canon / SMIF POD, etc. (*Specify one case type.)
Removal Coverage	Removal performance is not guaranteed within 5 mm from the outer edge of the reticle/mask.
Power Supply	AC 100–240 V, 50/60 Hz, 1 kVA
Required Utilities	Power / CDA or N₂ / Vacuum / Exhaust duct