Non-destructive Failure Analysis on Electronic Components Using the XGT-9000

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.

Foreign matter (Sn) is found under the IC chip.

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X-ray Analytical Microscope (Micro-XRF)

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