As semiconductor dimensions continue to shrink, the margin between a perfect wafer and a yield excursion is found in the tails of the distribution. Our world-class suite of particle analyzers provides the definitive metrology framework for the next generation of CMP. By combining the high-speed main-peak control of Laser Diffraction and Dynamic Light Scattering (DLS) with the high-resolution counting of Nanoparticle Tracking Analysis (NTA) and the precision of Advanced Centrifugal Sedimentation, we empower Slurry Suppliers and IDMs to govern the entire particle population—eliminating defects and stabilizing removal rates where it matters most.
Fractionation and detection of fine particles and multi-modal particle size distributions
When single‑peak particle data hides critical slurry variability, yield and polish quality suffer. The CENTRIFUGE reveals true bimodal CMP slurry distributions—so you can verify supplier consistency, control abrasive balance, and protect every wafer batch.
Size and Concentration
As CMP slurry particle sizes shrink, traditional liquid particle counters stop short—leaving critical nanoscale populations invisible. The ViewSizer 3000 reveals particles LPCs cannot see, down to ~10 nm, helping prevent hidden variability that can impact defectivity, yield, and polish performance.
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