Applications

Non-destructive thickness and composition analysis of NiP/Au plating on Cu contacts using micro-XRF

We carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a HORIBA X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.

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Related Products

XGT-9000
XGT-9000

X-ray Analytical Microscope (Micro-XRF)

XGT-9000SL
XGT-9000SL

X-ray Analytical Microscope
with a Super Large Chamber

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