Mass Flow Module
Deposition is a critical process in the semiconductor industry. HORIBA offers a wide range of products to optimize this process and improve yield.
Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas phase chemical process. ALD is considered a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals, typically called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin film is slowly deposited. ALD is a key process in the fabrication of semiconductor devices, and part of the set of tools available for the synthesis of nano materials.
Plasma-Enhanced ALD is a technique where plasma is used to enhance an atomic layer deposition (ALD) process, forming a thin-film coating. Like standard ALD, PEALD reacts specific chemical precursors but also cycles an RF-plasma to better control chemical reactions within the process. This allows high levels of conformality in production. It also requires a much lower temperature than standard ALD, making it suitable for temperature-sensitive materials.
【Process Control Solutions】
With advances in microfabrication, keeping chambers clean after processing has become essential to improving productivity in semiconductor deposition processes. The IR-400 Series Chamber Cleaning Endpoint Gas Monitor measures exhaust gas components such as SiF4 and CF4 in real time, helping optimize dry-cleaning endpoint detection, reduce cleaning gas consumption and cycle time, and extend part life.
The MV-2000 High-performance Mixed Injection System Liquid Vaporizer is designed to vaporize pure water and liquid chemicals. Its high-efficiency tornado-flow mechanism enables stable low-temperature vaporization, delivering excellent performance even with thermally sensitive liquids. In addition, it supports higher flow rates within the same footprint and operating temperature range as previous models, eliminating the need for layout changes.
The Micropole System QL Series Quadrupole Mass Analyzer monitors residual H2O adsorbed on chamber walls as well as H2O desorbed during the baking process. By monitoring residual and process gases in the process chamber and measuring base pressure, it is ideal for controlling vacuum chamber conditions and monitoring processes.
By applying our proprietary concepts and advanced technologies to each vaporization method — bubbling, baking, and direct vaporization — we deliver high-performance vaporization systems that meet increasingly demanding customer requirements.
Stable Liquid Supply for Continuous Operation
Long-term continuous operation requires a stable liquid supply. The LU Series Liquid Auto Refill System ensures stable operation by precisely controlling pressure and temperature. For baking systems, it stabilizes liquid temperature to prevent fluctuations in the vaporization tank; for direct vaporization systems, it maintains optimal pressure during refilling.
Safe Source Tank Replacement
When handling toxic or flammable materials, safe tank replacement is critical. The LU Series includes a standard safety function that purges residual material from the piping and verifies that no material remains.
Uninterrupted Supply During Tank Replacement
A built-in sub-tank enables continuous liquid supply even during source tank replacement.
Software Information
Open Source Software
EtherCAT Communication
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