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Thin Film Analysis

Thin Film characterization are important in the development phase of new materials to minimize the time to market of a new generation of devices and in the metrology step, which is required for improving the yield of a production line for minimizing wafer-to-wafer variation. HORIBA a leader in optical spectroscopy from deep UV to XRF offers a unique range of high-end tools for Materials and Thin Film Analysis which can used in R&DIn-Line or integrated in a process chamber.

Key Benefits:

  • Single sensor or multiple sensor platform
  • For 4”,6”, 8” and 12 “ wafer size
  • Fast measurement
  • Modular and easy customization for OEM integration
  • Global Application support.

Related Products

LEM Series
LEM Series

Camera Endpoint Monitor based on Real Time Laser Interferometry

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