GR-300 Series

Wafer Back Side Cooling System GR-300 Series

Wafer Back Side Cooling System

The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.

 

Segment: Semiconductor
Abteilung: Fluid Control
Produktionsfirma: HORIBA STEC, Co., Ltd.
  • Pressure control with more stability and accuracy
  • Mass flow sensor (Option)
  • Compatible for various fitting
  • RoHS compliance

 

Application example

In the below example, the GR-300 Series is controling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

 

Specifications of GR-300 Series


Dimensions of GR-300 Series

 

Informationsanfrage

Sie haben Fragen oder Wünsche? Nutzen Sie dieses Formular, um mit unseren Spezialisten in Kontakt zu treten.

* Diese Felder sind Pflichtfelder.

Zubehör

GR-500 Series
GR-500 Series

Wafer Back Side Cooling System

Verwandte Produkte

EC-5000 Series
EC-5000 Series

Exhaust Pressure Controller

PTFM-1000V2
PTFM-1000V2

Pitot Tube Exhaust Flow Meter

PV Series
PV Series

Piezo Actuator Valve

UR-Z700 Series
UR-Z700 Series

Digital Automatic Pressure Regulator

VG S Series
VG S Series

Capacitance Manometer

Corporate