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Material Characterization

          From blank wafer to final device, HORIBA’s analytical instrument for material characterization are used by leading end-user and research organization for more than 50 years. Designed to achieve ultimate performances, they are the right tools to accelerate the time to market and yield improvement in any processes involving thin film and advanced material deposition.

 

Roughness

       

Film thickness

         

Optical properties (n, k)

         

Band Gap

       

Crystallinity

        

Stochiometry

       

Chemical composition

         

Elemental composition

       

Defects

       

Impurities

         

Stress measurement

         

Doping concentration

         

Particle sizing

         

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