Mass Flow Controller
In critical cleaning processes following key semiconductor manufacturing steps such as CMP and etching, it is essential to remove chemical residues and particulate contaminants without damaging or altering the wafer surface. To optimize these cleaning processes, we offer a wide range of products that accurately monitor chemical concentrations in cleaning solutions.
【Process Control Solutions】
As semiconductor processes continue to scale down, more precise control of wafer surface conditions is required. The CS-1000 standalone Chemical Solution Monitoring System uses proprietary analytical technology combining absorbance, pH, and conductivity to accurately detect trace components in specialty chemicals.
High-precision concentration
measurement of
multi-component solutions
The CS-900F Fiber-optic Type Non-contact Chemical Concentration Monitor helps prevent leakage and contamination, improving safety and reducing chemical use. Tests on cleaning equipment confirmed equivalent performance to the conventional contact-type model (CS-600F), even in piping-mounted non-contact measurements.
The CS-620F Fiber-optic Type Hot Phosphoric Acid Concentration Monitor measures high-temperature, high-concentration phosphoric acid in real time without cooling. It is ideal for concentration control in the SiN etching process for 3D NAND manufacturing.
Monitoring dissolved oxygen in dilute HF and TMAH solutions used in semiconductor cleaning processes is critical, as it directly affects yield. The HD-960LR Dissolved Oxygen Monitor is also compatible with high-boiling-point organic solvents such as ethylene glycol, as well as volatile chemicals such as ammonia water.
Do you have any questions or requests? Use this form to contact our specialists.
