LabRAM Odyssey Semiconductor

LabRAM Odyssey Semiconductor

Photoluminescence and Raman Wafer Imaging

The LabRAM Odyssey Semiconductor microscope is the ideal tool for photoluminescence and Raman imaging on wafers up to 300 mm diameter. The HORIBA best-seller true confocal microscope is equipped with automated 300 mm sample stage and objective turret to fit both needs of wafer uniformity assessment and defects inspection.

Segment: Scientific
Oddělení: Raman Spectroscopy
Výrobní společnost: HORIBA France SAS

LabRAM Odyssey Semiconductor includes hardware and software designed for semiconductors analysis:

  • Wafer mapping with automated turret and sample stage
    The automated 300 mm × 300 mm XY sample stage accepts wafers up to 300 mm (12") diameter for Raman and Photoluminescence mapping of both full wafers and small regions of interest (ROI). The travel speed of the stage together with its stability ensure fast and reliable measurements over ROIs spread over the wafer surface.
     
  • Uniformity measurement with wafer tilt correction
    The “Tilt at midway” autofocus function corrects for any wafer bow and tilt, producing accurate whole wafer uniformity data, even from thin layers. This function is rapid since it determines the optimum focus height at only at five points prior to mapping: in the center and four points at midway between the center and the corners.
     
  • From full wafer to high resolution defect mapping with DuoScan
    DuoScan™ confocal imaging technology is a confocal imaging mode with both capabilities of variable size laser macro-spot scanning (using ultra-fast rastering mirrors) and high precision sub-micron step scanning. Macro-spot scanning is suitable for full wafer mapping while sub-micron step scanning is adapted to defect analysis.
     
  • PL and Raman metrology in one tool
    The availability of many excitation lasers together with the wide spectral range of the system, from deep UV to near IR, allows simultaneous measurement of photoluminescence and Raman signals in the same spectrum. PL and Raman in one tool significantly speeds up wafer characterization.
     
  • Methods: Easy recipe building for highly efficient characterization
    Methods will allow you to fully automate your entire Raman/PL characterization routine (acquisition, data processing, display, and analysis) providing high throughput that is manageable by metrology technicians.
    The “methods” building process is simple and intuitive : the process or metrology engineer can optimize each operation and in one click insert it into the recipe/method. Individual operations can be conveniently reordered, added or removed.
    This customization module is also aided by “templates” which is a way to save and recall a set of hardware configurations and software options.
     
  • ParticleFinder PF3: Automated particle characterization
    PF3 rapidly locates and chemically characterizes contaminants on a full wafer.
    PF3 automatically locates and Raman maps contamination particles. Also PF3 automatically identifies and classifies all detected impurities according to their chemical characteristics (organic, silicon, etc.).
    Statistics of morphological properties (area, perimeter, diameter, circularity, brightness, volume estimation, etc.) are also reported.
     

Dimensions

W × H × D (mm): 1400 × 620 × 1410

Optical microscope

Open space microscope with white light reflection illumination, camera, 5×, 10×, 100× objectives as standard. Optional motorized objective turret.

Spectral range

Standard 200 nm - 2200 nm from sample to detector (achromatic, no change of optics required).

Imaging spectrometer

  • Focal length: 800 mm.
  • Spectral resolution FWHM at 532 nm excitation wavelength ≤ 0.6 cm-1 with 1800 gr/mm and ≤ 0.3 cm-1 with 3000 gr/mm.
  • Spectral stability RMS: < 0.02 cm-1 RMS Measured on Si 520 cm-1 line.
  • Equipped with Open Electrode CCD (standard), optional EMCCD, optional InGaAs arrays detector (max. 3 detectors).

Spatial resolution

XY lateral resolution < 0.5 µm; Z axial resolution < 1.5 µm.

300 mm × 300 mm motorized stage

XY high precision encoded motorized stage (X = 300 mm, Y = 300mm) with repeatability ≤1 µm; accuracy = 1 µm; resolution (encoder) = 50 nm; minimum motor step size = 10 nm.
Z specifications: resolution (minimum step size) = 0.01 µm.
Holders for 4" (100 mm), 6" (150 mm), 8" (200 mm) and 12" (300 mm) size wafers available. Vacuum compatible wafer holders.

Lasers

User selectable: 266 nm, 325 nm, 355 nm, 405 nm, 458 nm, 473 nm, 532 nm, 633 nm, 660 nm, 785 nm, & 1064 nm. Up to 6 motorized.

DuoScan™

DuoScan™ technology for fast Laser scanning and Macrospot imaging (typical macrospot dimensions 30 µm × 30 µm with 50× objective).

2D Materials
2D Materials
The two-dimensional graphene and transition metal dichalcogenides materials are on their way to become the core of the future electronics devices. Controlling layer numbers and crystallinity at the wafer scale remains the main challenge.
Group IV Semiconductors
Group IV Semiconductors
The historically established group IV materials keep being the essential component of integrated circuits through more and more complex architectures (three dimensional: FinFET, Nanosheet FET, Gate-all-Around FET).
Compound Semiconductors
Compound Semiconductors
Compound semiconductors including III-V, III-N materials and SiC are being growingly employed owing to their superior material properties over silicon semiconductors and their role in optimizing the energy efficiency of devices.

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