In the packaging process, we provide X-ray fluorescence analysis that contributes to quality control and defect analysis of finished IC chips. We employ a method that utilizes a narrow, high-intensity X-ray beam generated by our proprietary X-ray focusing element, enabling high-speed measurement of minute areas compared to conventional methods using X-ray collimators. Furthermore, in the advanced packaging and chiplet processes, which have seen significant recent advancements, there is an exposure process similar to that in front-end processes. We provide photomask foreign particle inspection systems compatible with the wiring masks and other materials commonly used in these processes.