Stand-alone Type Chemical Concentration Monitor CS-100 Series


The CS-100 Series monitors measure in real time the concentrations of various types of chemical solutions and have the capability to control the timing of automatic chemical spiking.

Measurement is fully automatic; no measurement control is required once the measurements have begun. The operator needs only to prepare the chemical solution. In addition, air is used for the reference spectral measurements to be taken without abnormalities in the solution flow.


  • Concentration follow-up in real-time
  • Fully automatic measurements
  • Comprehensive measure to eliminate air bubble during sequential measurements

Target chemicals and measurement range

Manufactured by HORIBA Advanced Techno


Model name


Measurement principle

Absorption spectroscopic method

Sample temperature

20 to 30 Degree C

Ambient temperature

20 to 25 Degree C


Max. 4 components

Chemical range

Max. 4 ranges


Parallel I/O, Analog output, RS-232C

Analog output
(4-20 mA)

Max. 2 components


205(W) X 329(D) X 269(H)mm

Power source

DC 24V

Consumable parts

Halogen lamp



Wetted material

PTFE, PFA, Sapphire or Quartz





Dimensions of CS-100 Series


  • Cleaning and etching processes in semiconductor manufacturing
  • Cleaning processes in photovoltaic manufacturing
  • Optimize processes through continuous measurement of chemical solutions
  • Reduce usage volumes by extending life of chemical solutions
  • Reduce lot defects and increase product yield


  • Technical Article

Industrial In-line and Multi Component Monitor Using Absorption Spectroscopy and Its Application (1.6MB)

"Chemical concentration monitor, HORIBA CS series, is widely used in semiconductor wet process. Its measurement principle, Ultra Violet (UV) and Near Infrared (NIR) absorption spectroscopy, enables in-line and real-time monitoring for multiple component chemistry. Measuring various kinds of samples is achieved, such as Fe ion concentration in HCl, more than 5 component chemistry including by-product from etching, to H2O2 in CMP slurry. In this paper, measurement results for those samples are introduced."