Technology Hardware and Equipment

Simultaneous imaging of transmission X-rays and fluorescent X-rays is effective to find defects inside electronic components.

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.

Troubleshooting and defect analyses of components embedded within opaque resins are described, on both individual components and complete circuit boards. Quantitative analysis to the ppm level is ideally suited for ensuring compliance to the WEEE/RoHS directives.