Camera Endpoint Monitor based on Real Time Laser Interferometry
Our Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/deposition process.
Depending on applications, LEM camera includes a 670 or 905 or 980 nm laser and when mounted on any dry etch/deposition process chamber with a direct top view of the wafer this generates a small laser spot on the sample surface.
Interference occurs when monochromatic light hits the sample surface, resulting in different optical path lengths due to film thickness and height variations in the film.
This allows the etch/deposition rate and thus thickness to be monitored in real time, also fringes counting or more complex analysis, providing enhanced process control Endpoint for a wide variety of processes. Additionally interfaces can be detected by their change in reflectivity.
Based on the interferometry technique, LEM camera is ideally suited to etch/deposition rate monitoring, Fringes counting and endpoint detection, providing high precision detection of film thickness and trench depth and also interfaces.
The LEM camera can be mounted on any process chamber with direct top view of the wafer and provides a real-time digital CCD image of the sample surface making spot positioning simple.
Figure 1: Camera image makes spot positioning simple
Regarding Interferometry (Laser or Multiwavelength using broad Flash Lamp source), endpoint detection mostly consists in three steps:
To address these new requirements, HORIBA has developed a unique generation of Sensor (Hardware and Software), based on interferometry, for Endpoint, fault detection and Advanced Process Control (APC) adaptable to all etchers, to help engineers and Fab’s to manage actual and future products and technologies.
LEM-CT for Real-Time accurate and reliable Thickness/depth information
Besides plasma, Sample information is also complex. LEM-CT (as EV 2.0 INT),mounted on any process chamber with direct top view of the wafer,allows to obtain local information on optically semi-transparent, multi-layers structure. This allows the etch rate and thus etched thickness to be monitored in real time, providing enhanced process control for a wide variety of processes. Additionally, interfaces can be detected by their change in reflectivity.
Based on the interferometry technique, LEM-CT is ideally suited to etch/deposition rate monitoring and endpoint detection, providing high precision detection of Fringes counting, film thickness, trench depth, interfaces…
|System outline||LEM camera consists of a compact interference measurement section that includes the laser source, light receiver, and optical components, as well as the illumination and CCD imaging camera, allowing monitoring of any area of the wafer surface using microscopic images.|
|Light source||Laser diode|
|Light source wavelengths||670 nm, 905 nm, 980 nm|
|Magnification||50x (G50) or 120x (G120)|
|Spot diameter||20 μm to 100 μm,|
depending on camera to wafer distance
|Camera Dimensions||65 (W) × 160 (H) × 100 (D) mm|
2.6 (W) × 6.3 (H) × 3.9 (D) in
(camera only, excluding stage)
|Camera mass||1.2 kg, 2.6 lb|
|Remote||LEM-CT only may be connected to any host through digital Link with RJ 45 connector: TCP/IP.|
An optional SEQ70 box contains an interface board to provide galvanic isolation between the host controller hardware of the HOST / Tool from the box main electronics
|LEM SIGNAL BOX||LEM-CT only is provided with a LEM Signal BOX connected in USB on the PC to collect: |
|DC Power Supply||24V|
|SSD||256 Go, 2,5” SATAIII|
|Design||Aluminum Frame, fanless design|
Anti-vibration and shock resistant
USB 3.0 on Standard
2x RJ45 Gb
|Standard PC (Default)|
|CPU||64bits, Intel® Pentium® N4200, 2.5 GHz|
|Controller Dimensions||197 (W) x 110 (D) x 55 (H) mm|
|Controller Mass||2 kg|
|High Grade PC (Optional)|
|CPU||64bits, Intel® Core™ i7-7700T 2,9 GHz|
|RAM||8Go DDR4 2133MHz|
|Controller Dimensions||264 (W) x 96.4 (D) x 186.2 (H) mm|
|Controller Mass||4.5 kg|
|Manual XY stage|
|Manual XY stage Travel range||±8.0mm|
|Manual XY Stage dimensions||120 (W) × 120 (H) × 87 (D) mm|
4.7 (W) x 4.7 (H) x 3.4 (D) in
|Manual XY Stage Mass||1.3 kg, 2.8 lb|
|Motorized XY stage|
|Motorized XY stage Travel range||±12.5mm|
|Motorized Stage dimensions||167 (W) × 117 (H) × 112 (D) mm|
6.6 (W) × 4.6 (H) × 4.4 (D) in
|Motorized Stage Mass||2.6 kg, 5.6 lb|
|Accessories for SEQ70-PIO box and PC|
Humidity：0～70％RH （No dew condensation）
Humidity：0～70％RH （No dew condensation）
Sie haben Fragen oder Wünsche? Nutzen Sie dieses Formular, um mit unseren Spezialisten in Kontakt zu treten. * Diese Felder sind Pflichtfelder.