Semiconductor Page Heading

Deposition

Deposition process is a key step in the semiconductor industry. HORIBA offers a wide range of products to optimize this process and to increase the yield

Atomic Layer Deposition (ALD)

Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas phase chemical process. ALD is considered a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals, typically called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin film is slowly deposited. ALD is a key process in the fabrication of semiconductor devices, and part of the set of tools available for the synthesis of nano materials. 

Plasma-Enhanced ALD is a technique where plasma is used to enhance an atomic layer deposition (ALD) process, forming a thin-film coating. Like standard ALD, PEALD reacts specific chemical precursors but also cycles an RF-plasma to better control chemical reactions within the process. This allows high levels of conformality in production. It also requires a much lower temperature than standard ALD, making it suitable for temperature-sensitive materials. 

Chemical Vapor Deposition (CVD)

Chemical vapor deposition (CVD) is a deposition method used to produce high quality, high-performance, solid materials, typically under vacuum. The process is often used in the manufacture of semiconductors and in the production of thin films. 

In typical CVD, the substrate is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. CVD has an extended family of processes which build upon the primary principles of CVD most commonly these are: 

Atmospheric pressure CVD (APCVD) / Low-pressure CVD (LPCVD) 

Ultrahigh vacuum CVD (UHVCVD)

Plasma-Enhanced CVD (PECVD) 

Atomic-layer Deposition. 

Metalorganic chemical vapor deposition (MOCVD

Physical Vapor Deposition (PVD)

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. 

Sputtering techniques include; Magnetron, Ion Beam, Reactive, Ion Assisted, Gas Flow. 

Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. 

Fluid Controller & Module

D700MG
D700MG

High Speed & Precision Pressure Insensitive Mass Flow Module

D700WR
D700WR

Wide Range Pressure Insensitive Mass Flow Module

SEC-E Series
SEC-E Series

Mass Flow Controller

SEC-N100 Series
SEC-N100 Series

Digital Mass Flow Controller

CRITERION D500
CRITERION D500

Pressure Insensitive Mass Flow Module

DZ-100
DZ-100

Ultra-thin Mass Flow Module

SEC-Z500X Series
SEC-Z500X Series

Multi Range/Multi Gas Digital Mass Flow Controller

SEC-Z700S Series
SEC-Z700S Series

New concept Pressure Insensitive Mass Flow Module

FS-3000
FS-3000

Thermal Flow Splitter

PV Series
PV Series

Piezo Actuator Valve

UR-Z700 Series
UR-Z700 Series

Digital Automatic Pressure Regulator

Liquid Precursor Vaporizer

MV-2000
MV-2000

Mixed Injection System Liquid Vaporizer

VC Series
VC Series

Direct Liquid Injection System

LSC series
LSC series

Compact Baking System

LE Series
LE Series

Large Flow Liquid Source Vaporization Control System

MI-1000/MV-1000
MI-1000/MV-1000

Mixed Injection System Liquid Vaporizers

LF-F/LV-F Series
LF-F/LV-F Series

Digital Liquid Mass Flow Meters / Controllers

LU Series
LU Series

Liquid Auto Refill System

Process Monitor & Controller

Micropole System QL Series
Micropole System QL Series

Quadrupole Mass Analyzer

VG-200S
VG-200S

Capacitance Manometer

IR-300
IR-300

Vapor Concentration Monitor

IR-400
IR-400

High-grade type Gas Monitor for Chamber Cleaning End Point Monitoring

RU-1000
RU-1000

Plasma Emission Controller

VCC-100
VCC-100

Vapor Concentration Controller

IT-270
IT-270

High-Accuracy Infrared Thermometer [Built-in type]

IT-470F-H
IT-470F-H

High-Accuracy Infrared Thermometer [Built-in type]

IT-480 series
IT-480 series

High-Accuracy Infrared Thermometers [Stationary type]

EV 2.0 Series
EV 2.0 Series

Endpoint / Chamber Health Monitor based on Optical Emission Spectroscopy and MWL Interferometry

EV-140C
EV-140C

Optical Emission Spectroscopy Etching End-point Monitor

OES-Star
OES-Star

UV-VIS-NIR Spectrometer

PoliSpectra® M116 MultiTrack Spectrometer
PoliSpectra® M116 MultiTrack Spectrometer

Multispectra, Multifiber, Multichannel Imaging spectrometer with 8-16-32 Simultaneous UV-NIR Spectra

VU90 Spectrometer
VU90 Spectrometer

Most Compact Vacuum UV Back-Illuminated CCD Spectrometer (VUV-FUV)

VS70-MC
VS70-MC

Miniature Multi Communication UV-NIR Spectrometer

LEM Series
LEM Series

Camera Endpoint Monitor based on Real Time Laser Interferometry

Software Information
 Open Source Software
 EtherCAT Communication
 

Request for Information

Do you have any questions or requests? Use this form to contact our specialists.

* These fields are mandatory.

Corporate