Quantitative Analysis of Common Components in a Chemical Mechanical Polishing (CMP) Slurry Using Raman Spectroscopy

Chemical Mechanical Polishing (CMP) is a crucial step in semiconductor manufacturing. Quantifying the components of the slurry is crucial to ensuring an effective slurry that will not damage the wafer. Current techniques for quantification, such as Ion Chromatography (IC) and High-Pressure Liquid Chromatography (HPLC) have excellent limits of detection, but they are difficult, costly, and require experienced users. In this application note, Raman spectroscopy is explored as an easier and more flexible technique for quantifying common components in a CMP slurry, such as benzotriazole and glycine, without any sample preparation or costly consumables. Results show that Raman spectroscopy can reach estimated limits of detection and quantification of benzotriazole of less than 0.025% and 0.10% (both in mass percent), respectively, making Raman spectroscopy an ideal alternative to the more costly and time-consuming techniques like IC and HPLC.

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