
Compact Baking System
HORIBA's best-selling baking system has been developed to meet the requirements of today’s high technology industries. Without the need of a carrier gas, the system can provide stable vaporization of materials such as TEOS (at a rate of 600 SCCM) and H2O (at a rate of 2 SLM). For ease of access all device maintenance can be performed from the front of the unit.
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Flow rate generated | H2O 2SLM, TEOS 600 SCCM (Max.) |
Operating pressure | Max. 1.33kPa |
Source tank volume | 2.7L |
Heat regulation method | PID control by the heat regulator |
Liquid surface detection method | Floating switch |
Internal mass flow controller | SEC-8400 series |
Air pressure valve | Bellows type |
Materials in liquid connection and gas contact area | SUS316L, PFA |
Operating Temperature | 20 to 35°C |
External input | Air pressure valve open/close, mass flow controller flow rate setting signal (0 to 5 V DC/0 to 100% F.S.), emergency stop signal, auto zero signal (option) |
External output | Temperature alarm, liquid level H.H. alarm, liquid level signal (H, M, L), READY signal, mass flow controller flow rate output signal ((0 to 5 V DC/0 to 100% F.S.), thermoregulated bath internal fan stop alarm, valve voltage monitor (option) |
Power source | AC 100 V, single phase 50/60 Hz, 1.5 kVA |
Other | Auto-recharge system: Can be connected to LU series. |
* The flow rate control range varies with the type of liquid. | |
* SCCM and SLM are symbols indicating gas flow rate (mL/min, L/min at 0°C, 101.3 kPa). |
External Dimension
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