Non-destructive Failure Analysis on Electronic Components Using the XGT-9000

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.

Foreign matter (Sn) is found under the IC chip.

제품 문의

HORIBA제품의 자세한 정보를 원하시면, 아래의 양식에 내용을 입력을 부탁드립니다.

Browse Products