Fast thickness measurement of thin metal coatings by Micro-XRF
The penetrating nature of EDXRF analysis allows multi-layered samples to be characterised with a single measurement. With high spatial resolution even microscopic features such as bonding pads on circuit boards can be interrogated for composition and layer thickness.
Quality control and defect analysis in the electronics industry using micro-XRF
Troubleshooting and defect analyses of components embedded within opaque resins are described, on both individual components and complete circuit boards. Quantitative analysis to the ppm level is ideally suited for ensuring compliance to the WEEE/RoHS directives.
The combination of the XGT-5000’s ground breaking spatial resolution and sensitivity means it is the instrument of choice for fast analysis of electronic components, whether for analysis of restricted harmful elements (the WEEE/RoHS ‘lead free’ legislation), trouble shooting, or R&D.