Electrical Equipment

我们使用HORIBA 微区X射线荧光分析仪对柔性印刷电路上的铜触点上双层NiP/Au镀层进行了镀层厚度和成分分析。没有任何样品制备的情况下成功地检测到了超薄层中的金。金镀层和NiP镀层的厚度结果与预期值一致，且具有良好的重复性。

Our XGT-9000SL allows failure analysis at a microscopic level on a large sample, non-destructively, thanks to its large chamber capacity and its microprobes.

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.

The penetrating nature of EDXRF analysis allows multi-layered samples to be characterised with a single measurement. With high spatial resolution even microscopic features such as bonding pads on circuit boards can be interrogated for composition and layer thickness.

Troubleshooting and defect analyses of components embedded within opaque resins are described, on both individual components and complete circuit boards. Quantitative analysis to the ppm level is ideally suited for ensuring compliance to the WEEE/RoHS directives.

The combination of the XGT-5000’s ground breaking spatial resolution and sensitivity means it is the instrument of choice for fast analysis of electronic components, whether for analysis of restricted harmful elements (the WEEE/RoHS ‘lead free’ legislation), trouble shooting, or R&D.

Optical Fiber Manufacturing Process

Internal temperature management for household appliances

Temperature management for air conditioners

Check heating value of electronic devices

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