Back to Particle Characterization Products Overview

High Repeatability Particle Size Distribution Measurement of Colloidal Silica for CMP Slurries

Particle Characterization

Chemical Mechanical Polishing (CMP) technology is used as an essential fundamental technology in the manufacturing process of large scale semiconductor integrated circuits (LSI). Colloidal silica are widely used as CMP slurries because of their clean spherical shape created by the sol-gel method, which causes less polishing damage.

Since it is used for very precise polishing, its particle size is controlled with extremely high quality, and the particle size analyzer used for it must have high resolution and measurement repeatability. Colloidal silica was measured by Partica CENTRIFUGE, a centrifugal nanoparticle analyzer, and its measurement repeatability was confirmed.

Application Downloads

Related Products


원심 나노 입자 분석기

제품 문의

HORIBA제품의 자세한 정보를 원하시면, 아래의 양식에 내용을 입력을 부탁드립니다.