
Semiconductors
The following analytical and instrumental techniques are used in Semiconductors, please click on the squares for further information.
Alloy Composition, Bandgap | ||||||||
Bandgap, PLE / PL | ||||||||
Compound Alloys | ||||||||
Contamination | ||||||||
Crystallinity (Silicon) | ||||||||
Doping Effects | ||||||||
Ferroelectric Thin Films | ||||||||
Fluorescence Spectra of CdSe Nanoparticles | ||||||||
Hetero-Structures | ||||||||
High, Low k Materials | ||||||||
Analysis of Multilayer Structures on Silicon | ||||||||
ONO Film | ||||||||
Optical Properties | ||||||||
Oxidized Porous Silicon | ||||||||
Photoluminescence | ||||||||
Plasma Etch End Point | ||||||||
Process Chemicals e.g. Pure Water, H2SO4, H3PO4, HCl, HNO3, NH3, Photo-resist | ||||||||
Porous Silicon | ||||||||
Quality Control Materials for Wafer Manufacturing | ||||||||
Quantitative Analysis of BPSG on Silicon | ||||||||
Raw Materials for Trace Elements | ||||||||
SOI Film | ||||||||
Stress / Strain | ||||||||
Super Lattice Structure and Defect Investigations | ||||||||
Superconductor | ||||||||
Thickness (Monolayer, Multi-Layers, Native Oxide, Roughness, Interface) | ||||||||
Thin Film Transistors, MOSFET, OTFT | ||||||||
Uniformity over Film Area and Depth | ||||||||
Fast elemental depth profiling | ||||||||
Contacts (silicides) |