Compact Baking System LSC series

Compact Baking System LSC series

HORIBA's best-selling baking system has been developed to meet the requirements of today’s high technology industries. Without the need of a carrier gas, the system can provide stable vaporization of materials such as TEOS (at a rate of 600 SCCM) and H2O (at a rate of 2 SLM). For ease of access all device maintenance can be performed from the front of the unit.

 

Segment: Semiconductor
Division: Fluid Control System
Base product
Manufacturing Company: HORIBA STEC Co. Ltd.
  • High Flow Rate Gasification
  • The LSC-A100 provides stable gasification of materials such as TEOS 600SCCM and H2O 2SLM
  • All device maintenance can be performed at the front of the unit
  • An optional PocketPC type PDA can be used to monitor the operating conditions of the LSC and to record and analyze operation logs.

 

 

 

Flow rate generated

H2O 2SLM, TEOS 600 SCCM (Max.)

Operating pressure

Max. 1.33kPa

Source tank volume

2.7L

Heat regulation method

PID control by the heat regulator

Liquid surface detection method

Floating switch

Internal mass flow controller

SEC-8400 series

Air pressure valve

Bellows type

Materials in liquid connection and gas contact area

SUS316L, PFA

Operating Temperature

20 to 35°C

External input

Air pressure valve open/close, mass flow controller flow rate setting signal (0 to 5 V DC/0 to 100% F.S.), emergency stop signal, auto zero signal (option)

External output

Temperature alarm, liquid level H.H. alarm, liquid level signal (H, M, L), READY signal, mass flow controller flow rate output signal ((0 to 5 V DC/0 to 100% F.S.), thermoregulated bath internal fan stop alarm, valve voltage monitor (option)

Power source

AC 100 V, single phase 50/60 Hz, 1.5 kVA

Other

Auto-recharge system: Can be connected to LU series.

  

* The flow rate control range varies with the type of liquid.

* SCCM and SLM are symbols indicating gas flow rate (mL/min, L/min at 0°C, 101.3 kPa).

 

External Dimension

 

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