After chemical treatment of semiconductor wafers for cleaning, etching or stripping applications, or MEMS device KOH/HF etching applications, the process chemicals should be completely removed from the surface in order to stop the chemical reaction and take away chemical residues. Chemistry is still covering the wafer surface, in particular within recess structures of the topology (moats, trenches) resulting in continuation of the chemical process outside the bath. This is critical for etch applications, since over-etching might occur destroying the pattern and causing significant yield loss. Custom plastic tanks, PFA tanks are the common choices for quick dump rinsing steps.
Three types of rinsing are used in semiconductor manufacturing, depending on the tool type and application:
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